Formation : Master of Science Electronique et Telecommunications
Se former
avec ISEP
- Renseignements :
- Durée : 0 Jour
- Type : 3ème cycle/MBA
- Diplômant : Oui
- Prix H.T. € :
11600.00
- Objectifs :
- In the last decade the technology for manufacturing
integrated circuits has seen an explosive growth.
Modern highly integrated circuits may contain hundreds
millions of transistors and switching elements.
Due to the large sizes of the integrated circuits encountered
in industry and their complexity, the design
techniques has shifted from ASIC-like design to Advanced
VLSI circuits allowing the integration of complex systems
into one chip. In addition, due to security requirements,
biometry systems will be widely used in the near future. The
convergence between VLSI and biometry opens new routes
and challenges.
The objectives of this program is to make students familiar
with new developments, recent progress, and
innovations in the field of image and signal processing as
well as design and implementation of complex VLSI circuits.
Emphasis is on current and future challenges in research
and development in both academia and industry.
- Pré-requis :
- The program is open to graduates with a Bachelor’s degree or equivalent in related fields.
- CORE SYLLABUS
n Core technical skills
> Hardware architectures
> CMOS circuits
> VHDL for simulation and synthesis
> Digital and analog signal processing
> Object technology, C++ programming
> Operating systems analog signal processing
> Data communication networks
n Fundamentals of international business
> Economics principles
> Intercultural relations
> Corporate organization
> Communication, negotiation
n French Course
INTERNSHIP (Third Semester)
The internship with an international company (5 to 12 months) will enable to display valuable professional skills and attitudes
developed during the two academic semesters. ISEP will help you in finding an internship. Companies usually give an allowance
to the trainees.
The whole program is taught in English
www.isep.fr First Semester
Second Semester
n Image and Signal Processing for Security:
> Image acquisition systems
> Tools for image processing (2D Fourier transform,
histogram, wavelet transform, PCA…)
> Image processing techniques (pre-processing,
segmentation) System & architecture design
> Image analysis (representation, features
extraction, fusion, classification)
n System Specification and Validation :
> System specification languages structures
> SystemC
> Esterel
> VerilogC
> Functional verification
n Hardware Software Partitioning:
> Multiprocessors based partitioning
> Heterogeneous platforms
> Sw/Hw interface issues…
n Hardware Architectures:
> Embedded Processors (MPU, DSP, ASSP)
> Memory Hierarchy
> Interconnect networks
> Wrappers
> Standard interfaces…
n Platforms for Rapid Prototyping:
> Reconfigurable Platforms
> Prototyping and Emulation
n Advanced VLSI Design:
> Advanced VHDL modeling
> RTL synthesis
> Advanced Digital Circuit Design
> Low power design techniques
> Power management
> Test
> Layout implementation (Place and Route)…
n Project:
The project makes the link between most of the
previous topics. It starts with algorithms
development, validation and profiling on a biometry
software platform. After partitioning, the biometry
system will be mapped on a platform based on a
DSP and an FPGA that includes an embedded
microprocessor. One block of the system will be
implemented as a VLSI chip. The project will be
conducted in parallel during a full semester.
